Utilization of water reed in production of various insulation panels

Resource type
Journal Article
Authors/contributors
Title
Utilization of water reed in production of various insulation panels
Abstract
Some panels and particleboards were made from reed mats and blends of reed-wood chips to be used inside buildings for sound and heat insulations. It was seen that the outer layers of the reed body (spike) was almost water resistant and exceptionally resistant to the penetration of common adhesives. Therefore, the panels from stitched reed mats exhibited very poor mechanical strength. The sound transmissions of such panels (1–3 km/s) made with various combinations, however, were recorded to be excellent compared with that of particleboards made of wood (17 km/s). Blends of reed chips (2 cm) and wood chips, however, gave particleboards with better mechanical properties (5–17 MPa) than that of panels made from reed mats (2 MPa). An increasing amount of reed chips in tested particleboards was recorded to be improving both sound and heat insulations from 17 to 6 km/s and from 0.34 to 0.27 W/mK, respectively. The bending strength of samples, however, was reduced from 26 to 5 MPa. Thickness swelling was also noted to increase from 18% to 85% due to reed chips addition. It was concluded that the outer layers of water reeds should be modified via chemical and/or enzymatic methods to increase the interfacial bounds between adhesives.
Publication
Science and Engineering of Composite Materials
Volume
20
Issue
4
Pages
371-377
Date
2013-11-01
Language
en
ISSN
2191-0359
Accessed
02/04/2024, 09:00
Library Catalogue
Rights
De Gruyter expressly reserves the right to use all content for commercial text and data mining within the meaning of Section 44b of the German Copyright Act.
Extra
Publisher: De Gruyter
Citation
Karademir, A., Yetis, F., Imamoglu, S., & Varlıbas, H. (2013). Utilization of water reed in production of various insulation panels. Science and Engineering of Composite Materials, 20(4), 371–377. https://doi.org/10.1515/secm-2013-0014